IEEE transactions on components, packaging, and manufacturing technology [publicación periódica]

Material type: Text

TextPublication details: New York : Institute of Electrical and Electronics Engineers, 1997Description: v. : tbs. ; 28 cmSubject(s):

LOC classification:

Contents:

Contenido: v.1. Enero-Julio 1997 -- v.2. Febrero-Noviembre1997 -- v.3. Marzo-Diciembre 1997

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Holdings
Item type	Current library	Collection	Call number	Copy number	Status	Barcode
Préstamo	Biblioteca Pedro Arrupe	Acervo	TS 195 A1 I826 (Browse shelf(Opens below))	V. 1 Ej. 1	Available	141159
Préstamo	Biblioteca Pedro Arrupe	Acervo	TS 195 A1 I826 (Browse shelf(Opens below))	V. 2 Ej. 1	Available	143494
Préstamo	Biblioteca Pedro Arrupe	Acervo	TS 195 A1 I826 (Browse shelf(Opens below))	V. 3 Ej. 1	Available	141395

Previous				No cover image available	No cover image available	No cover image available	No cover image available	Next
Previous	TS 195 .4 P75 2010 Print formats and finishes : the designer's illustrated guide to brochures, catalogs, bags, labels, packaging and promotion /	TS 195 .4 P75 2010 Print formats and finishes : the designer's illustrated guide to brochures, catalogs, bags, labels, packaging and promotion /	TS 195 A1 B47 The Best in packaging	TS 195 A1 I826 IEEE transactions on components, packaging, and manufacturing technology	TS 195 A1 I826 IEEE transactions on components, packaging, and manufacturing technology	TS 195 A1 I826 IEEE transactions on components, packaging, and manufacturing technology	TS 195 A3 D58 Diseño gráfico aplicado a envases y embalajes	Next

Publicación Trimestral

Contenido: v.1. Enero-Julio 1997 -- v.2. Febrero-Noviembre1997 -- v.3. Marzo-Diciembre 1997

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