Process technology for silicon carbide devices /

Process technology for silicon carbide devices / edited by Carl-Mikael Zetterling - London, United Kingdom INSPEC, IEE c2002 - xxii, 176 p. il., tbs. 25 cm. - EMIS processing series 2 .

Incluye referencias bibliográficas

Advantages of SiC -- Bulk and epitaxial growth of SiC -- Ion implantation and diffusion in SiC -- Wet and dry etching of SiC -- Thermally grown and deposited dielectrics on SiC -- Schottky and ohmic contacts to SiC -- Devices in SiC.

0852969988


Carburo de silicón ---Propiedades eléctricas

TP 261 C3 / P76 2002